§

Load-Lock:

Single/Multi-chip automatic Load-Lock chamber, optional

§

Pumping system:

Crypump/Magnetic suspension molecular pump + Dry pump

§

Vacuum gauge:

Full range vacuum gauge + Capacitive diaphragm vacuum gauge

§

Flow control:

Mass flow controller

§

Sputter power supply:

DC/RF/Pulse DC, can be switched freely

§

Bias:

RF/Pulse DC

§

Ion source:

RF & Kaufman & Hall ion source, optional

§

Number of cathodes:

Up to 2

§

Ultimate vacuum:

1E-5Pa

§

Temperature control range:

10℃ to 300℃

§

Uniform deposition area:

Max. Ø200mm

§

Coating uniformity:

±2%

§

Coating repeatability:

±2%

§

Space requirements:

3.61m（Length）*2.7m（Width）*2.4m（Height）